Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)

Copper flake, 1-5 micron, 99.9% (metals basis)
Gold Palladium wire, 0.2mm (0.008in) dia, annealed, 99.9% (metals basis)
AA041205-007 CELL CULTURE PLACE PS 12 WELL Size: 10G
Technical
AA041205-008 CELL CULTURE PLACE PS 12 WELL Size: 50G
Technical
AA041205-011 CELL CULTURE PLACE PS 12 WELL Size: 250G
Technical
Description
Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis)
CAS No
7440-50-8
Specification
Product Details
AA041205-007

Data sheet

Pack Size
250g
CAS No
7440-50-8

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