Magnesium oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis excluding Ca)
Molybdenum silicide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis)
Molybdenum silicide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis)
Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)
Niobium(V) oxide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis)
Niobium(V) oxide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.95% (metals basis)
Niobium(V) oxide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.95% (metals basis)
Silicon carbide sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)
Silicon carbide sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis excluding B)
Silicon carbide sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.5% (metals basis excluding B)
Silicon carbide sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.5% (metals basis excluding B)
Silicon(IV) nitride, MgO binder, sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.9% (metals basis)
